PCB Fabrication
High-precision multilayer boards, rigid-flex boards, HDI boards, high-frequency boards, metal substrates, and thick copper boards.
- 1-32 layers
- FR-4, high-TG, halogen-free and high-frequency materials
- Multiple surface finishes
PCBA manufacturing capability and quality control
ULIKE connects engineering review, materials coordination, SMT placement, DIP soldering, testing and finished assembly into one controlled delivery flow.
01005Small chip placement support
0.3mmMinimum BGA pitch reference
600x320mmMaximum SMT PCB size
1-32LPCB fabrication range
Service scope
Service scope
Four practical service directions are kept under one manufacturing capability flow.
PCBA Manufacturing
Prototype and batch PCBA production with SMT placement, DIP soldering, BGA processing, conformal coating, testing, and packaging.
- 01005 chip placement
- 0.3 mm BGA pitch
- ICT/FCT and aging tests
CAD Engineering
High-speed PCB layout, signal integrity planning, EMC improvement, footprint library support, and design-for-manufacturing review.
- PADS, DXP and PowerPCB references
- Stack-up planning
- Reverse engineering support
EMS Turnkey Delivery
Hardware development, component sourcing, assembly, testing, finished product integration, plastic tooling, and logistics coordination.
- OEM/ODM cooperation
- Material sourcing
- Final assembly and shipment
Equipment and technical range
Technical capability
ULIKE combines imported SMT placement equipment, AOI, BGA rework, reflow and wave soldering equipment for prototype and batch production.
SMT production
- YAMAHA YSM20 / YSM10 and imported placement equipment
- Component range reference: 01005 to 150mm
- Minimum placement accuracy reference: +/-0.03mm
PCB fabrication support
- 1-32 layers
- Minimum line width / spacing reference: 3.0 mil
- FR-4, high-TG, halogen-free and high-frequency materials
Inspection and test
- AOI visual inspection
- BGA rework and solder joint review
- Programming, function test and aging test support
Industry experience
Manufacturing experience covers industrial, medical, communication, power, automotive and smart security electronics.
Industrial control
Control boards, power modules and automation equipment.
Medical electronics
Medical testing modules and equipment power assemblies.
Communication modules
Video communication boards, SDI/HDMI modules and network equipment.
Smart security
Camera mainboards, monitoring modules and finished assembly support.
Process capability
Manufacturing flow
Each production stage has a clear input, review point and output record so engineering issues are found before they become delivery risks.
- 01
Engineering review
Review Gerber, BOM, placement files, package polarity, stencil design, material substitutions and manufacturability risks.
- DFM check
- BOM availability
- Stencil and fixture review
- Process route confirmation
- 02
SMT placement
Support high-speed placement, 01005 chips, BGA/CSP components, AOI inspection and reflow profile control.
- First article inspection
- AOI inspection
- Reflow profile check
- BGA and polarity control
- 03
DIP and post soldering
Handle through-hole insertion, wave soldering, manual soldering, connector review and power-device solder joint checks.
- DIP and hand soldering review
- Programming
- ICT / FCT when required
- Aging or sampling test
- 04
Testing and shipment
Coordinate programming, ICT/FCT when required, aging or sampling tests, ESD packaging, labels and shipment records.
- Appearance inspection
- ESD packaging
- Label check
- Delivery record
Quote preparation
Before quotation
A practical checklist for PCB, PCBA, CAD engineering and EMS turnkey projects.
Engineering package
Gerber / PCB file / BOM and approved alternatives / Assembly drawing and coordinates / Mechanical or enclosure limits
Manufacturing route
PCB fabrication only / SMT + DIP assembly / Programming and functional testing / Finished product assembly
Commercial details
Prototype or batch quantity / Target lead time / Packing and logistics notes / Export or domestic delivery address