Case Detail

project record

PCBA Manufacturing Cases

Anti-copy IC Marking Removal PCBA

Anti-copy IC Marking Removal PCBA

Anti-copy IC Marking Removal PCBA is a PCBA production reference project from ULIKE. The case highlights SMT placement, DIP soldering, testing, conformal coating, BGA handling, and turnkey material coordination, with original process notes covering QFP IC 0.4mm间距双面贴片,防盗版IC除字.

Ask About Similar Projects
  • CategoryPCBA Manufacturing Cases
  • Project date2011-4-8 8:53:41
  • Image records4

Process notes

  • QFP IC 0.4mm间距双面贴片,防盗版IC除字

Delivery attention

  • Confirm the approved BOM before purchasing, especially IC, connector and BGA alternatives.
  • Keep one confirmed sample as the golden sample for programming, function test and appearance comparison.
  • For repeat orders, keep the same stencil, fixture, test method and packing label requirements.

Project record

ULIKE handled this anti-copy ic marking removal pcba project with attention to board construction, component placement accuracy, soldering stability, and functional verification. Key technical notes include: QFP IC 0.4mm间距双面贴片,防盗版IC除字.

The work is suitable for OEM and ODM customers that need a reliable partner from engineering review through production handoff.

Anti-copy IC Marking Removal PCBA 1
Anti-copy IC Marking Removal PCBA 2
Anti-copy IC Marking Removal PCBA 3
Anti-copy IC Marking Removal PCBA 4
Back To Cases