Case Detail
project record
PCBA Manufacturing Cases
Fine-pitch BGA And WiFi Module Assembly
Fine-pitch BGA And WiFi Module Assembly is a PCBA production reference project from ULIKE. The case highlights SMT placement, DIP soldering, testing, conformal coating, BGA handling, and turnkey material coordination, with original process notes covering BGA 0.4mm间距模块焊接加工,wifi模组.
Ask About Similar ProjectsProcess notes
- BGA 0.4mm间距模块焊接加工,wifi模组
Delivery attention
- Confirm the approved BOM before purchasing, especially IC, connector and BGA alternatives.
- Keep one confirmed sample as the golden sample for programming, function test and appearance comparison.
- For repeat orders, keep the same stencil, fixture, test method and packing label requirements.
Project record
ULIKE handled this fine-pitch bga and wifi module assembly project with attention to board construction, component placement accuracy, soldering stability, and functional verification. Key technical notes include: BGA 0.4mm间距模块焊接加工,wifi模组.
The work is suitable for OEM and ODM customers that need a reliable partner from engineering review through production handoff.
Image record
Photos are kept as production and project references.