Case Detail
PCBA Manufacturing Cases
DIP Wave Soldering Power Board
DIP Wave Soldering Power Board is a PCBA production reference project from ULIKE. The case highlights SMT placement, DIP soldering, testing, conformal coating, BGA handling, and turnkey material coordination, with original process notes covering X光机设备电源板加工，插件波峰焊接！.
Ask About Similar ProjectsProcess notes
- X光机设备电源板加工，插件波峰焊接！
- 板厚2.00mm
- 规格300*250mm、
- 板重1000g、
- 嵌入5小板、
- 均双面贴片、插件混装
Delivery attention
- Confirm the approved BOM before purchasing, especially IC, connector and BGA alternatives.
- Keep one confirmed sample as the golden sample for programming, function test and appearance comparison.
- For repeat orders, keep the same stencil, fixture, test method and packing label requirements.
Project record
ULIKE handled this dip wave soldering power board project with attention to board construction, component placement accuracy, soldering stability, and functional verification. Key technical notes include: X光机设备电源板加工，插件波峰焊接！; 板厚2.00mm; 规格300*250mm、; 板重1000g、; 嵌入5小板、; 均双面贴片、插件混装; SMD chip种类多于220种，DIP件种类多于120种.
The work is suitable for OEM and ODM customers that need a reliable partner from engineering review through production handoff.
Image record
Photos are kept as production and project references.
