Case Detail
PCBA Manufacturing Cases
Waterproof Treatment For Power Communication Board
Waterproof Treatment For Power Communication Board is a PCBA production reference project from ULIKE. The case highlights SMT placement, DIP soldering, testing, conformal coating, BGA handling, and turnkey material coordination, with original process notes covering 电力通讯智能版防水处理（喷涂三防漆）.
Ask About Similar ProjectsProcess notes
- 电力通讯智能版防水处理（喷涂三防漆）
- 板厚1.6mm 四层板
- SMD：0402
- 双面贴片
- BGA球间距0.3mm
- 防静电袋包装
Delivery attention
- Confirm the approved BOM before purchasing, especially IC, connector and BGA alternatives.
- Keep one confirmed sample as the golden sample for programming, function test and appearance comparison.
- For repeat orders, keep the same stencil, fixture, test method and packing label requirements.
Project record
ULIKE handled this waterproof treatment for power communication board project with attention to board construction, component placement accuracy, soldering stability, and functional verification. Key technical notes include: 电力通讯智能版防水处理（喷涂三防漆）; 板厚1.6mm 四层板; SMD：0402; 双面贴片; BGA球间距0.3mm; 防静电袋包装.
The work is suitable for OEM and ODM customers that need a reliable partner from engineering review through production handoff.
Image record
Photos are kept as production and project references.
